| |
Cleaning |
|
3.Lead
forming should be performed prior to soldering.
|
| |
1.
Special
care shall be taken when applying the chemicals listed below for
cleaning
because certain chemicals may damage the surface
of l
ens
or
case
and cause discoloration.
|
4.Avoid
applying any stress to resin in order to prevent
the epoxy
fracture and break on bonding wire.
|
| |
| |
5.Avoid
Forming the lead Frame at the same point twice or more.
|
|
|
Solvent
|
Adaptability
|
|
Ethyl alcohol,
lsopropyl alcohol
|
O
|
|
Trichloroethylene,
Chlorothene
Acetone,
Thinner
|
X
|
|
|
| Soldering |
|
1.Be
sure not mount LEDs in conditions where excessive stress is applied to
lead
frames.
|
| |
|
|
|
2.Dipping
time: 2 minutes max. at normal temperature.
|
|
|
|
2.The
mounting direction of the flat package type LED should be such that
the
direction of the LED electrodes is perpendicular to the direction of
the board
curve.
|
|
|
| |
Forming |
3.Ever-Led
will not guarantee
LEDs
mounted
directly on the board because the
resin
bodies may be damaged by the applied force from board - warping,
lead-cutting
or clinching when being soldered. (
It
is
strongly recommended
that this should be carried out after very careful preparation.)
|
|
.
|
1.The
lead frame should be bent at a point 2 mm away from the body resin.
|
|
|
|
4.Care
should be taken to avoid any shock or vibration to the LED resin body
after
it has been soldered until
the temperature of the
LED
has
returned to
normal.
|
|
|
2.Bending
should be performed with the base firmly fixed by means of a jig
or
radio pliers.
|
|
|
|
5.Conditions
|
|
| |
|
Types
|
Soldering iron
|
Dip soldering
|
Reflow soldering
|
|
|
|
Temperature
at tip of iron:
|
| 300°Cmax. |
|
(300 W
max.)
|
|
soldering
time: 3 sec. max.
|
|
Location:
At least 3 mm
|
|
away from
resin body
|
|
|
|
Pre-heating: 100°C
max.(Resin
surface
|
| temperature) |
| 60 sec. max. |
| Bath temperature: 260±5°C |
| (Small package: 240±5°C |
|
Dipping time: 5 sec.
max.
|
|
Location:
At least 3.0mm away from resin body)
|
|
Not recommended
|
|
|
|
Temperature at tip
of iron:
|
| 300°Cmax. |
| (300 W max.) |
|
soldering time: 3 sec.
max.
|
|
Location: At least
2.6 mm
|
| away from resin body |
|
|
Pre-heating:
80
°Cmax.(Resin surfacetemperature)
|
| 60 sec. max. |
| Bath temperature: 260±5°C |
| (Small package: 240±5°C |
|
Dipping time: 5 sec.
max.
|
|
Location:
At least 3.0mm away from resin body)
|
|
Not recommended
|
|
